JPH0317907B2 - - Google Patents

Info

Publication number
JPH0317907B2
JPH0317907B2 JP60214758A JP21475885A JPH0317907B2 JP H0317907 B2 JPH0317907 B2 JP H0317907B2 JP 60214758 A JP60214758 A JP 60214758A JP 21475885 A JP21475885 A JP 21475885A JP H0317907 B2 JPH0317907 B2 JP H0317907B2
Authority
JP
Japan
Prior art keywords
discharge
electrode
processed
cathode material
cathode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60214758A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6277460A (ja
Inventor
Yoshinori Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuda Seisakusho Co Ltd
Original Assignee
Tokuda Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuda Seisakusho Co Ltd filed Critical Tokuda Seisakusho Co Ltd
Priority to JP21475885A priority Critical patent/JPS6277460A/ja
Publication of JPS6277460A publication Critical patent/JPS6277460A/ja
Publication of JPH0317907B2 publication Critical patent/JPH0317907B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
JP21475885A 1985-09-30 1985-09-30 放電電極 Granted JPS6277460A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21475885A JPS6277460A (ja) 1985-09-30 1985-09-30 放電電極

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21475885A JPS6277460A (ja) 1985-09-30 1985-09-30 放電電極

Publications (2)

Publication Number Publication Date
JPS6277460A JPS6277460A (ja) 1987-04-09
JPH0317907B2 true JPH0317907B2 (en]) 1991-03-11

Family

ID=16661067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21475885A Granted JPS6277460A (ja) 1985-09-30 1985-09-30 放電電極

Country Status (1)

Country Link
JP (1) JPS6277460A (en])

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2761875B2 (ja) * 1987-08-25 1998-06-04 キヤノン株式会社 バイアススパッタリング法による堆積膜形成装置
IT1211938B (it) * 1987-11-27 1989-11-08 Siv Soc Italiana Vetro Apparecchiatura e procedimento per la deposizione di uno strato sottile su un substrato trasparente, particolarmente per la realizzazione di vetrature
JPH03247761A (ja) * 1990-02-23 1991-11-05 Yoshihisa Nakamura スパッタターゲット装置
GB9006073D0 (en) * 1990-03-17 1990-05-16 D G Teer Coating Services Limi Magnetron sputter ion plating
US5496455A (en) * 1993-09-16 1996-03-05 Applied Material Sputtering using a plasma-shaping magnet ring
JP5550565B2 (ja) 2008-12-15 2014-07-16 株式会社アルバック スパッタリング装置及びスパッタリング方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH659484A5 (de) * 1984-04-19 1987-01-30 Balzers Hochvakuum Anordnung zur beschichtung von substraten mittels kathodenzerstaeubung.

Also Published As

Publication number Publication date
JPS6277460A (ja) 1987-04-09

Similar Documents

Publication Publication Date Title
KR940010866A (ko) 마이크로파 플라즈마 처리장치 및 처리방법
JPH0317907B2 (en])
JPS6156277A (ja) 成膜装置
KR101827472B1 (ko) 절연물 타겟
JPH0241583B2 (en])
JPH0241584B2 (en])
JPH01175738A (ja) ドライエッチング装置
JPH0342608Y2 (en])
JPS59121747A (ja) イオンミリング方法
JPH10121235A (ja) 複合スパッタリングカソード、そのカソードを用いたスパッタリング装置
JPS5916975A (ja) スパツタリング装置
JPH05156432A (ja) 電子サイクロトロン共鳴装置
JPH0216381B2 (en])
JP2980956B2 (ja) 高周波プラズマｃｖｄ装置
JPS55141721A (en) Sputtering apparatus for magnetic body
JPH0737231Y2 (ja) イオン注入装置
KR20230045541A (ko) 성막 장치
JPS6342707B2 (en])
JPH0527047U (ja) 対向ターゲツト式スパツタ装置のシールドカバー
JPH07105380B2 (ja) プラズマ処理装置
JPS63290274A (ja) 金属薄膜製造装置
JPS6234415B2 (en])
JPH04216624A (ja) 半導体製造装置
JPH0460542U (en])
JPS6311560U (en])